To Improve Daily Production Ouput Using Lean Manufacturing (Dadang Redantan)
TO IMPROVE DAILY PRODUCTION OUPUT Using Lean Manufacturing Approach At PT. XYZ Batam Dadang Redantan Industrial Engineering Program, Faculty of Engineering, University of Riau Kepulauan (UNRIKA) Jl. Letjend Suprapto, Bukit Tempayan, Batu Aji, Kota Batam, Kepulauan Riau 29425 E-Mail :
[email protected] ABSTRAK Penelitian ini bertujuan untuk meningkatkan output produksi harian tipe LGA Sirkuit Terpadu (IC) di PT. XYZ Batam untuk memenuhi permintaan pelanggan. Metode yang digunakan adalah Lean Manufacturing. Hasil yang ditunjukkan dengan menghilangkan beberapa limbah akan meningkatkan kapasitas. Kata kunci : Produksi Ouput, Pengiriman On-time, Balancing, Produksi IC, Inspeksi Akhir.
1. INTRODUCTION PT. XYZ is an electronic manufacturing company who produce Integraged Circuit (IC). This company in the daily operation will produce the output using make to order strategy. As long as customer demand equal to or less than the existing production capacity, company should have no issue to serve customer demand. One of the main customer suddently request output more than existing capacity, existing capacity is only set for 220,000 unit per day while customer demand is 300,000 unit per day. This research mean to apply Lean Manufacturing concepts to find out all the possibility of waste in production process and eliminate wast to improve daily production output to meet customer demand. 2. METHODOLOGY OF RESEARCH 2.1. Lean Manufacturing Lean Manufacturing is systematic approach to eliminate wast and change the process. This will reach by identify and
eliminate waste with continuous improvement (AP, Wisnu and Partner, 2013) Lean Manufacturing motivate to make flexibility in production system which able to adopt in customer demand with sleam production and low inventory stock (Gaspersz, Vincent, 2007). Lean Manufacturing will use to eliminate waste and create balance production capacity to meet customer demand. Lean Manufacturing has become common theme in today’s manufacturing environment, for both commercial and defense industries. Lean Manufacturing is the common name for concepts exemplified by the Toyota Production System, with the overall philosophy of eliminating the source of waste in the manufacturing process (Altarum et all). There are 8 type of waste which summary by word of DOWN TIME, consist of defects, over production, waiting, nonproduction hour, transportation, inventory in excess, motion and extra processing.
Figure 1. Eight (8) Type of Waste Which Summary by word of DOWN TIME. 820
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Table 1. Customer Demand July ~ December 2015 Pacakge
Jul-15
Aug-15
Sep-15
LGA IC
6.000.000
6.000.000
6.000.000
Oct-15
Nov-15
6.000.000 9.000.000
Dec-15
9.000.000
Table 2. Delivery to Customer July ~ December 2015 Pacakge
Jul-15
Aug-15
Sep-15
Oct-15
Nov-15
Dec-15
LGA IC
5.950.000
6.000.000
5.950.000
6.000.000
6.600.000
6.600.000
3. RESULT AND DESCRIPTION OF RESULT Following is all the flow for IC LGA production from wafer incoming inspection and end by Final Visual Inspection and Packing the product (Figure 1). Base on the data from Customer Service Department, below is customer demand data from July 2015 up to December 2015.
We can see there is an increase of demand in November 2015 from average of 6,000,000 units per month become 9,000,000 units per month (Table 1). Base on existing production capacity condition, company not able to meet all the customer requirement. Especially for November 2015 and December 2015, company only able to deliver 6,600,000 unit vs actual demand 9,000,000 units (Table 2).
Figure 2. Flowchart for IC LGA Production.
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To Improve Daily Production Ouput Using Lean Manufacturing (Dadang Redantan)
Table 3a. The Actual Capacity Per Every Single Process of LGA IC No. Sample
INCOMING
BACKGRIND
WF MOUNT
WAFER SAW
2ND OPT
Flip Chip
Die Attach
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30
10332 10330 10398 10349 10346 10393 10374 10354 10337 10365 10434 10407 10314 10393 10317 10312 10378 10381 10417 10392 10367 10316 10374 10339 10439 10369 10399 10389 10318 10324
24145 24238 24288 24161 24149 23950 24126 24365 23928 24376 24512 24042 24042 23936 24164 24407 23986 24022 24229 24185 24490 24313 24010 24305 24117 24526 24196 23753 24190 24263
21713 22638 21213 21796 21213 22156 22434 21647 22398 22377 21489 22082 22371 22510 22089 22031 21913 21909 21718 21670 21635 22490 22057 21985 22575 21764 22442 21977 21488 21242
8145 8090 8141 8123 8141 8100 8118 8121 8117 8078 8131 8088 8093 8086 8155 8110 8095 8131 8101 8088 8126 8140 8106 8128 8137 8125 8108 8116 8091 8126
10087 10099 10053 10172 100172 10204 10073 10112 10075 10131 10088 10131 10128 10061 10098 10155 10151 10060 10048 10099 10188 10140 10085 10184 10109 10188 10132 10166 10098 10171
5092 5059 5101 5071 5071 5047 5046 5021 5081 5057 5072 5029 5038 5089 5038 5082 5080 5080 5061 5060 5083 5050 5019 5039 5118 5054 5084 5099 5078 5088
3944 3935 3919 3955 3951 3934 3936 3945 3926 3949 3945 3959 3919 3959 3926 3952 3956 3945 3955 3957 3959 3930 3954 3912 3936 3927 3921 3920 3931 3950
Die Attach Cure 24394 24381 24396 24393 24386 24389 24388 24391 24380 24379 24379 24394 24395 24386 24378 24379 24390 24380 24387 24391 24389 24379 24388 24395 24380 24385 24389 24387 24387 24396
WIRE BOND 1987 1982 1983 1978 1988 1975 1978 1987 1982 1987 1987 1989 1983 1984 1989 1989 1986 1974 1983 1988 1977 1984 1974 1989 1991 1976 1982 1976 1980 1981
Table 3b. The Actual Capacity Per Every Single Process of LGA IC Under Fill 3650 3649 3602 3630 3636 3625 3627 3602 3599 3609 3614 3648 3600 3625 3617 3592 3630 3642
Under Fill Cure 24520 24521 24521 24529 24512 24517 24524 24526 24521 24521 24521 24526 24518 24529 24513 24525 24530 24527
3rd OPT
LID ATTACH
IA Cure
MARKING
SAWSING
FVI
PACKING
4332 4348 4340 4346 4364 4365 4362 4351 4340 4362 4356 4344 4361 4380 4339 4350 4367 4333
2564 2564 2559 2577 2573 2563 2570 2573 2582 2557 2560 2564 2580 2579 2567 2583 2572 2571
25721 25709 25723 25719 25723 25717 25712 25707 25717 25712 25713 25711 25704 25717 25720 25716 25707 25715
10399 10343 10420 10374 10418 10392 10383 10375 10330 10420 10350 10369 10405 10371 10399 10359 10408 10353
3758 3773 3731 3784 3748 3783 3752 3737 3760 3764 3753 3743 3745 3742 3766 3757 3743 3743
4350 4270 4224 4374 4359 4273 4338 4331 4297 4345 4341 4304 4334 4258 4356 4291 4302 4236
6777 6795 6764 6772 6775 6761 6811 6769 6735 6787 6735 6765 6782 6785 6759 6738 6753 6759
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Table 3b. The Actual Capacity Per Every Single Process of LGA IC Under Fill 3642 3628 3609 3609 3636 3621 3648 3620 3623 3639 3635 3629
Under Fill Cure 24531 24514 24530 24530 24526 24522 24519 24524 24526 24527 24520 24512
3rd OPT
LID ATTACH
IA Cure
MARKING
SAWSING
FVI
PACKING
4355 4352 4366 4366 4358 4371 4343 4338 4376 4361 4377 4346
2558 2560 2571 2571 2564 2582 2579 2567 2561 2566 2568 2555
25716 25713 25714 25714 25710 25713 25707 25716 25712 25712 25710 25720
10442 10399 10384 10384 10356 10417 10343 10358 10426 10416 10402 10361
3766 3776 3765 3765 3768 3740 3759 3747 3756 3757 3742 3733
4332 4348 4289 4263 4269 4336 4309 4251 4237 4314 4341 4329
6773 6794 6763 6815 6752 6746 6768 6731 6788 6781 6804 6800
Table 4. Summary All The Unit Per Hour Machine Station Incoming Inspection Backgrind Wafer Mount Ws 2nd Opt Flip Chip Die Attach Die Attach Cure Wire Bond Under Fill Under Fill Cure 3rd Opt Lid Attach LA Cure Marking Saw Sing Fvi Packing
Below table 3a – 3b is show the actual capacity per every single process of LGA IC. From above detail we can summary all the unit per hour machine capacity in below table 4.
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UPH / Machine 9329 21768 19811 7303 9108 4561 3546 21948 1785 3262 22070 3919 2312 23142 9346 3380 3876 6094
Below is data of machine station, operator allocation and machine allocation for all process.
To Improve Daily Production Ouput Using Lean Manufacturing (Dadang Redantan)
Table 5. Data of Machine Station, Opertor Allocation and Machine Allocation for All Process Station Incoming Inspection Backgrind Wafer Mount Ws 2nd Opt Flip Chip Die Attach Die Attach Cure Wire Bond Under Fill Under Fill Cure 3rd Opt Lid Attach LA Cure Marking Saw Sing Fvi Packing
Operator 2 1 1 2 2 3 4 1 5 5 1 3 7 1 2 6 3 4
We can summary all the capacity per day for all the process flow as per below graph, we can see that 3rd optical
Machine Alocation 2 1 1 2 2 3 4 1 10 5 1 3 7 1 2 6 3 4
Machine Available 4 1 1 3 3 4 7 1 12 5 1 5 7 1 4 6 5 5
inspection station and final visual inspection station is 2 station which become bottle neck for the operation to meet customer demand.
Figure 3. Capacity Per Day Before Line Balancing Chart.
Figure 4. Capacity Per Day After Line Balancing Chart.
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After line balancing we can see below is capacity per day for all process flow on figure 3 and 4. Base on existing condition, company not able to meet all customer demand which show in the following on time delivery data in below chart.
After the improvement, we can see that starting march 2016 company able to meet most of the customer demand which show in following chart.
Figure 5. Delivery Ontime December 2015 Chart.
Figure 6. Delivery Ontime March 2015 Chart. 4. CONCLUSION The research identify there are two station which impact alot of waiting the production process due to bottle neck capacity in 3rd optical inspection station and final visual inspection station. By applied line balancing methode as one of the Lean Manufacturing tools, we can increase the capacity in the two mension bottle neck. We can see the improvement by comparing on time delivery data before and after imrovement. REFERENCES A.M.
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Kilpatrick, Lean Manufacturing Principles : A comprehensive Framework for Improving Production Efficiency.
AP., Wisnu and Partner., 2013. Lean Manufacturing panduan penerapan praktis, e-book Serial Sistem Manajemen Industri, Indonesia. Gaspersz, Vincent., 2002. Pedoman implementasi program six sigma terintegrasi dengan ISO 9001 : 2000. PT. Gramedia Pustaka Utama, Jakarta. Gaspersz, Vincent., 2007. Lean Six Sigma for manufacturing and service industries, PT. Gramedia Pustaka Utama, Jakarta. Ross & Associates Environmental Consulting, ltd. Lean and Water Toolkit, akses online 31 Agustus 2015, URL : http://www.epa.gov/lean/environme nt/toolkits/water/resources/leanwater-toolkit.pdf. T. Phelps, T. Hoenes and M. Smith., 2003. Developing Lean Supply chains, A Guidebook, December.